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      OPEN

      Semiconductor Lithography Equipment
      FPA-6300ES6a
      High Resolution / High Productivity KrF Scanner

      • Features
      • Specifications

      Basic Information

      Model Name: FPA-6300ES6a

      Features

      FPA-6300ES6a scanners deliver High-Productivity

      Processing time was reduced by speeding up the exposure process with a new-design Reticle & Wafer Stages, by improving alignment sequences and wafer handling time reduction. The throughput of the FPA-6300ES6a is over *200 wph (wafers per hour) which is 1.6 times higher productivity than previous FPA-6000ES6a model scanners.

      • *300 mm (12 inch) wafer, 98 shots, with Options applied

      FPA-6300ES6a scanners realize industry-leading Overlay Accuracy

      To minimize overlay misalignment & intrafield distortion during exposure, advanced stage vibration & synchronous control technologies were adopted in the FPA-6300ES6a. The alignment scope was also improved in order to measure the alignment marks on a wafer more accurately.
      Furthermore, by accurately controlling the temperature of the exposure area and the reticle area, **industry-leading Mix & Match overlay accuracy of ≤ 5nm has been realized.

      • **as of December 14, 2016 (Examination by Canon), with Options applied

      FPA-6300ES6a scanners provide high-reliability

      The FPA-6300ES6a platform provides substantial improvements in terms of base durability and maintenance requirements, as well as reduced install times and increased system uptime and availability when compared to earlier FPA-6000 Platform scanners. FPA-6300ES6a options and upgrades further improve overlay accuracy and productivity, offering scalability to support next-generation semiconductor manufacturing.

      Specifications

      Resolution
      ≦ 90 nm
      NA (Numerical Aperture)
      0.86~0.50 (Variable)
      Reduction Ratio
      1:4
      Field Size
      26 mm x 33 mm
      Exposure Wavelength
      KrF 248 nm
      Reticle Size
      6 inch
      Wafer Size
      200 mm (8 inch), 300 mm (12 inch) (Selection)
      Overlay Accuracy
      ≦ *5 nm
      Main Body Dimensions
      (W) 2,300 x (D) 5,155 x (H) 2,900 mm
      Major Options
      Various Mix & Match Overlay Improvement Options
      Various Throughput Improvement Options
      Various CD Uniformity Improvement Options
      Focus Accuracy Improvement Option (F-MAP)
      Focus Spot Automatic Chuck Cleaning
      Various Productivity Improvement Options
      AFIS Illumination System
      SMIF OHT Kit
      PC Remote Console
      Online Function (GEM2)
      Pellicle Particle Checker
      • *= Options Required
      燕赵福利彩票