<u id="looid"></u>

  1. <samp id="looid"><td id="looid"></td></samp>
    1. <u id="looid"></u>
    2. <b id="looid"><p id="looid"><thead id="looid"></thead></p></b>

      <table id="looid"><p id="looid"></p></table>


      Semiconductor Lithography Equipment
      FPA-5520iV / FPA-5520iV HR Option
      i-line stepper for advanced packaging enhanced for FOWLP applications with high productivity

      • Features
      • Specifications

      Basic Information

      Model Name: FPA-5520iV / FPA-5520iV HR Option


      FPA-5520iV addresses next-generation packaging production challenges including Fan Out Wafer Level Packaging [FOWLP]

      FPA-5520iV steppers have functions designed for processing of reconstituted FOWLP Wafers that consist of individual die that are mounted and encapsulated onto a carrier substrate for further processing. FOWLP wafers can suffer from severe warpage and die shift that must be overcome.

      FPA-5520iV steppers employ a wafer handling system with flexible vacuum pads on robot end-effectors and other countermeasures to vacuum chuck warped substrates.

      FPA-5520iV stepper wafer stages adopt a new wafer chucking system with increased suction to secure and flatten substrates, allowing high optical performance.

      FPA-5520iV steppers utilize a new wide-field alignment scope with a field-of-view that is doubled vs. FPA-5510iV steppers, making automatic wafer alignment possible when wafers contain large amounts of die shift, to improve equipment utilization and productivity.

      FPA-5520iV is a high performance i-line stepper

      FPA-5520iV steppers achieve the highest levels of productivity among leading edge i-line steppers.*
      FPA-5520iV steppers employ newly developed high-intensity illumination optics system that realizes an approximately 30% improvement in illumination intensity vs. FPA-5510iV steppers. FPA-5520iV steppers reduce exposure times for the thick photo-resist processes to boost back-end wafer processing capacity as much as **20%.

      • *Among same-class i-line steppers. As of July 4, 2016 (Examination by Canon)
      • **Throughput compared with the FPA-5510iV. 300 mm wafers, 60 shots, 10000J/m2 dose

      FPA-5520iV inherits the benefits proven by the FPA-5510iV stepper

      FPA-5520iV steppers inherit the proven high-resolution projection lens and imaging performance of the FPA-5510iV stepper.
      FPA-5520iV steppers provide the same alignment system options as FPA-5510iV steppers to deliver robust and accurate overlay performance.
      FPA-5520iV steppers adopt FPA-5510iV stepper console software with common operation procedures and easy recipe conversion.

      FPA-5520iV HR Option achieves resolution of 0.8um to support the advanced packaging process

      In response to the growing demand for high-density redistribution layer wiring in the FOWLP market, "FPA-5520iV HR option" has been released since December 2018. The FPA-5520iV HR Option employs a new projection optical system that achieves a resolution of 0.8µm, the finest resolution available in packaging-oriented lithography systems.

      • * Among same-class i-line steppers. With flatess equal to Si wafer. As of December 10, 2018. Based on a Canon survey.


      FPA-5520iV: ≦1µm
      FPA-5520iV HR Option: ≦0.8µm
      Reduction Ratio
      Field Size
      52 mm x 34 mm
      Exposure Wavelength
      i-Line 365nm
      Reticle Size
      6 inch
      Wafer Size
      300 mm (12 inch)
      Overlay Accuracy
      ≦ 150 nm
      Main Body Dimensions
      (W) 2,300 x (D) 3,340 x (H) 2,700 mm
      Major Options
      Through-Silicon Alignment Scope (TSA-Scope)
      Wafer Edge Shielding Unit
      Wafer Edge Exposure Unit
      Chemical Filter
      Resist Outgas Exhaust Unit
      PC Remote Console
      Online Function
      Pellicle Particle Checker
      Illumination System Purge Unit